Mechanical design and packaging of antenna, RF, digital, infrastructure, and test hardware products, including avionics modules, racks, and interface test adapters. Perform thermal and structural analyses as required. Support electrical-mechanical tradeoffs and physical verification and qualification testing for new designs, as required. Mentor & lead Jr. Mechanical Engineers.
Basic Qualifications: 9-13 experience with electronics packaging design, including producibility constraints, solids modeling techniques, GD&T, corrosion control, EMI concerns, and thermal/structural analysis methods. Shall have effective verbal and written communication skills, and the demonstrated ability to function within a small technical team. Shall be capable of designing to a hardware requirements specification. Proficiency in the use CATIA V5 is required. Proficiency in the use Patran/Nastran or Flotherm tools is a plus. BSME is required.
MSME is a plus.
Military avionics experience is preferred.
Sorry but we have no relocation funds available for this opening.
Northrop Grumman is an Equal Opportunity Employer committed to hiring and retaining a diverse workforce.
U.S. Citizenship is required for most positions. Security Clearance Required.
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